Three-dimensional circuit board

摘要

The invention relates to a three-dimensional circuit board (1), comprising a carrier component (10; 30), carrying at least one circuit path (110, 120) at an outside of a carrier body (100; 300) of the carrier component (10; 30), wherein, for impedance control, the carrier body (100; 300) comprises a deepening (102), wherein the circuit path (110, 120) is at least partially arranged in the deepening (102).