| 摘要 |
<p>According to one embodiment, a device module includes a mounting substrate (70), a device (1), and a bonding agent (83). The mounting substrate (70) has a mounting surface (71) and a plurality of pads (72, 73). The device (1) includes a plurality of electrode surfaces (61, 62) arranged in a first direction. The pad (72, 73) has a first width portion (72a, 73a) and a second width portion (72b, 73b). The first width portion has a width in a second direction orthogonal to the first direction. The second width portion (72b, 73b) is wider than the first width portion (72a, 73a) and the electrode surfaces (61, 62) in the second direction. One end portion (61a, 62a) in the first direction of the electrode surface (61, 62) is bonded to the pad (72, 73) on the first width portion (72a, 73a) via the bonding agent (83). The other end portion (61b, 62b) in the first direction of the electrode surface (61, 62) is bonded to the pad on the second width portion (72b, 73b) via the bonding agent (83).</p> |
