| 摘要 |
Corson alloy characteristics are improved by controlling the distribution profile of Ni-Si compound particles. Disclosed is a copper alloy for electronic materials comprising Ni: 0.4 to 6.0 mass% and Si: 0.1 to 2.0 mass%, and the remainder of which is composed of Cu and inevitable impurities, in which alloy for electronic materials, small Ni-Si compound particles with a particle size of 0.01 µm or greater and less than 0.05 µm, and large Ni-Si compound particles with a particle size of 0.05 µm or greater and less than 5.0 µm are present. The quantitative density of the small particles is 106 to 1010 particles per 1 mm2, and the quantitative density of the large particles is 1/10,000 to 1/10 the aforementioned quantitative density of the small particles. |
