| 摘要 |
A cleaning apparatus cleans a peripheral part of a substrate to be processed W. The cleaning apparatus includes a first cleaning part 11 configured to be brought into contact with a peripheral part of a front surface Wa of the substrate to be processed W and rotated in an in-plane direction of the substrate to be processed W, and a second cleaning part configured to be brought into contact with a peripheral part of a rear surface Wb of the substrate to be processed W and rotated in the in-plane direction of the substrate to be processed W. A frictional force to be applied from the second cleaning part 12 to the rear surface Wb of the substrate to be processed W is larger than a frictional force to be applied from the first cleaning part 11 to the front surface Wa of the substrate to be processed. |
