| 摘要 |
PURPOSE: A substrate bonding device is provided to evenly bond a substrate by uniformly pressurizing the whole area of the substrate. CONSTITUTION: An upper adhesion member (120) is formed through the whole area of an upper plate (110) formed at an upper chamber (100) for maintaining an upper substrate by adhesive power. Multiple upper lift pins of the upper plate are ascended and descended for separating the upper substrate. A lower adhesion member (220) is formed at a lower plate (210) formed at a lower chamber (200) for maintaining a lower substrate boned with the upper substrate by the adhesive power. Multiple lower lift pins of the lower plate are ascended and descended for separating the lower substrate. |
