| 摘要 |
The present invention discloses a bonding film composition used for a semiconductor assembly, comprising an acrylic resin, an epoxy resin, an aromatic amine hardener, a filter and a silane coupling agent. The bonding film composition keeps a low melt viscosity and a high residual curing ratio after a curing circulation by reducing a curing reaction rate, so that a gap is removed from a moulding process using an epoxy moulding compound (EMC), thereby ensuring a high reliability. The present invention also discloses a bonding film which is formed by the bonding film composition and used for the semiconductor assembly. |
