Light emitting device package and method of manufacturing the same

摘要

Disclosed is a light emitting device package. The light emitting device package includes a semiconductor substrate (11b) comprising a first surface (A) at a first depth (h1) from an upper surface of the semiconductor substrate and a second surface (B) at a second depth (h2) from the first surface; and a light emitting part (25) on the second surface of the semiconductor substrate.