Method for creating a 3D stacked multichip module

摘要

A 3D stacked multichip module comprises a stack of W IC dies. Each die has a patterned conductor layer, including an electrical contact region with a plurality of pads and device circuitry over a substrate. The pads of the stacked dies are aligned. Electrical connectors extend into the stack to contact pads of the dies to create a 3D stacked multichip module. The electrical connectors pass through vertical vias in the electrical contact regions. The pads may be arranged in a stair stepped arrangement. The stacked multichip module may be made using a set of N etch masks with 2 N-1 being less than W and 2 N being greater than or equal to W.