| 摘要 |
<p>PURPOSE: A lens mounting type light emitting diode package is provided to reduce the deterioration of luminous efficiency due to an air layer or gas layer between an LED(Light Emitting Diode) chip and a mounting type lens. CONSTITUTION: A package body(10) includes a recess for mounting an LED chip(20). The sidewall of the recess is tilted. A lead electrode(30) is composed of an anode and a cathode. A lens(40) is mounted on the upper side of the recess. The lens protects the LED chip embedded in the recess from an external environment.</p> |
