| 发明名称 |
Process for assembling an integrated circuit package having a substrate vent hole |
| 摘要 |
The present invention involves a method of providing an integrated circuit package having a substrate with a vent opening. The integrated circuit package includes a substrate having an opening and an integrated circuit mounted to the substrate. An underfill material is dispensed between the substrate and the integrated circuit. |
| 申请公布号 |
USRE44629(E1) |
申请公布日期 |
2013.12.10 |
| 申请号 |
US20040001714 |
申请日期 |
2004.11.30 |
| 申请人 |
RAMALINGAM SURESH;VODRAHALLI NAGESH;COSTELLO MICHAEL J.;LOKE MUN LEONG;MAHAJAN RAVI V.;INTEL CORPORATION |
发明人 |
RAMALINGAM SURESH;VODRAHALLI NAGESH;COSTELLO MICHAEL J.;LOKE MUN LEONG;MAHAJAN RAVI V. |
| 分类号 |
H01K3/10;H01L21/60;H01L21/56 |
主分类号 |
H01K3/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
