THE METHOD FOR PREPARING ORGANIC ELECTRONIC DEVICE

摘要

The present invention relates to a method for preparing an organic electronic device using a bonding film. According to the present invention, the method for preparing an organic electronic device provides a sealing layer having excellent anti-moisture and adhesion. Also, the method for preparing an organic electronic device minimizes the warpage of the organic electronic device even if the sealing layer is formed on the front surface of the organic electronic device, prevents damage to the organic electronic device, and reduces process time.