发明名称 Flex-rigid wiring board and method for manufacturing the same
摘要 Provided are a flex-rigid wiring board having an increased shielding effect and improved productivity with reduced number of manufacturing process steps, and a method for manufacturing the flex-rigid wiring board. The flex-rigid wiring board consists of a flexible cable section (32) having a shielding layer (45) on an outer surface, and a rigid mounting section (34) having a wiring layer (47) provided on the same surface as the shielding layer (45). The shielding layer (45) and the wiring layer (47) are made of a same sheet of continuous copper foil (46). The wiring layer (47) is plated and is made thicker than the shielding layer (45). A same continuous insulating layer (48) is provided on outer sides of the shielding layer (45) and the wiring layer (47) of the mounting section (34).
申请公布号 US8604346(B2) 申请公布日期 2013.12.10
申请号 US20090989485 申请日期 2009.04.23
申请人 URATSUJI ATSUHIRO;SONY CORPORATION 发明人 URATSUJI ATSUHIRO
分类号 H05K1/00;H05K3/02;H05K3/10 主分类号 H05K1/00
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