发明名称 |
Semiconductor module |
摘要 |
A semiconductor module is disclosed that includes a semiconductor element, a capacitor configured to be electrically connected to the semiconductor element and a heat sink, wherein the semiconductor and the capacitor are stacked with each other via the heat sink, and wherein the semiconductor element is disposed in a position overlapping with the capacitor as viewed from a stack direction. |
申请公布号 |
US8604608(B2) |
申请公布日期 |
2013.12.10 |
申请号 |
US201213448915 |
申请日期 |
2012.04.17 |
申请人 |
TSUCHIYA JIRO;SASAKI TORAHIKO;IMAI MAKOTO;TOJIMA HIDEKI;HARADA TADAKAZU;MITSUNAGA TOMOAKI;TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
TSUCHIYA JIRO;SASAKI TORAHIKO;IMAI MAKOTO;TOJIMA HIDEKI;HARADA TADAKAZU;MITSUNAGA TOMOAKI |
分类号 |
H01L23/34;H01L23/10;H05K7/20 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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