| 摘要 |
The purpose of the present invention is to provide a polishing device and a polishing method, capable of precisely controlling a polished profile of a wafer and, more especially, a polished profile in a wafer edge part. The polishing device comprises: a substrate support device (1) including a substrate support surface (45a) which press a substrate (W) against a polishing surface (2a) and a retaining ring (40) which surrounds the substrate (W) and is in contact with the polishing surface (2a); a rotating mechanism (13) which rotates the substrate support device (1) around its own axis; and at least one local load applying mechanism (100) which applies a local load on a part of the retainer ring (40). The retainer ring (40) can be tilted independently of the substrate support surface (45a) and does not rotate with the substrate support device (1). |
