BONDING DEVICE CAPABLE OF CHANGING VACCUM CHANNEL'S POSITION CORRESPONDING TO DRIVER IC'S POSITION

摘要

PURPOSE: A bonding device for changing the position of a vacuum channel corresponding to the position of a driver IC is provided to minimize heat loss due to vacuum and to prevent bonding fault due to heat. CONSTITUTION: A panel is placed in a base plate(100). A bonding head(400) is located in the upper part of a base plate. A bonding head transfers a driving chip(500) to the upper part of the panel and compresses the driving chip. At least one vacuum channel(120) passes through the base plate. A control system(140) is connected to the vacuum channel and controls the suction pressure of the vacuum channels.