| 摘要 |
<p>A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer which is formed on the upper side of the insulation layer, a conductive pad which is formed on the upper side of the conductive seed metal layer, a metal post which is substantially formed on the center of the upper side of the conductive pad, and a solder resist layer which surrounds the conductive pad and the metal post.</p> |
