SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

摘要

The present invention relates to a substrate treating apparatus using a supercritical fluid. According to one embodiment of the present invention, the substrate treating apparatus includes a housing; a support member supporting the substrate and formed in the housing; a supercritical fluid supply unit storing the supercritical fluid; a supply pipe with a supply valve controlling the amount of the supercritical fluid supplied from the supercritical fluid supply unit to the housing and connecting the supercritical fluid supply unit and the housing; and a vent pipe branched from the supply pipe and discharging the supercritical fluid remaining in the supply pipe. The vent pipe includes an opening/closing valve for opening/closing the vent pipe.