LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME, PACKING UNIT THEREOF

摘要

A laminated chip electronic component according to an embodiment of the present invention includes: a ceramic body which includes internal electrodes and dielectric layers; first and second external electrodes which are formed to cover both end parts of the longitudinal direction of the ceramic body; an active layer which forms a capacity by being arranged so that the internal electrodes face with each other across the dielectric layer; upper and lower cover layers which are formed in the upper or lower parts of the thickness direction of the active layer and in which the lower part of the thickness direction is thicker than the upper part of the thickness direction; and an additional electrode layer which is arranged regardless of capacity formation in the lower cover layer. When regulating: 1/2 of the total thickness of the ceramic body to be A; the thickness of the lower cover layer to be B; 1/2 of the total thickness of the active layer to be C; and the thickness of the upper cover layer to be D, the D which is the thickness of the upper cover layer satisfies the range of D >= 4μm and (B+C)/A which is a ratio at which the central part of the active layer deviates from the central part of the ceramic body is able to satisfy the range of 1.069 <= (B+C)/A <= 1.763.