发明名称 |
Chip attach adhesive to facilitate embedded chip build up and related systems and methods |
摘要 |
Present embodiments are directed to an adhesive and method for assembling a chip package. The adhesive may be used to couple a chip to a substrate, and the adhesive may include an epoxy-based dielectric material, an epoxy resin, a photoacid generator, an antioxidant, and a cold catalyst corresponding to the photoacid generator. |
申请公布号 |
US8604612(B2) |
申请公布日期 |
2013.12.10 |
申请号 |
US20090389060 |
申请日期 |
2009.02.19 |
申请人 |
SAIA RICHARD JOSEPH;GORCZYCA THOMAS BERT;GENERAL ELECTRIC COMPANY |
发明人 |
SAIA RICHARD JOSEPH;GORCZYCA THOMAS BERT |
分类号 |
H01L23/12;C08G59/68;C09J163/00;H01L21/58 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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