| 摘要 |
<p>A POP package and a manufacturing method thereof are disclosed. The POP package according to the present invention comprises: a lower semiconductor package which includes a first substrate, a first semiconductor die, which is placed on the top of the first substrate, and solder balls which are formed on the bottom of the first substrate; an upper semiconductor package which includes a second substrate, a second semiconductor die which is placed on the second substrate, and solder balls which are placed on the bottom of the second substrate, and which is placed on the lower semiconductor package and attached to the first substrate through the solder balls; and a mold part which integrally unites the lower semiconductor package with the upper semiconductor package, wherein the mold part unites the solder balls formed on the first substrate with an area including an contact part of the first substrate.</p> |
