发明名称 COVER HAVING METAL GRID STRUCTURE AND METHOD FOR FORMING THEREOF
摘要 Provided are a cover having a metallic grid structure and a method for manufacturing the cover. The cover includes a pattern portion formed of a metallic material, in which a plurality of patterns are independently disposed spaced apart from each other and an injection portion disposed between pattern portions to connect the pattern portions, the injection portion being formed of a non-metallic material. The method includes the steps of: forming a pre-pattern portion including patterns in a regular or irregular form and a bridge connecting the patterns, on a metallic plate; forming the injection portion on the pre-pattern portion by insert-injection or thermo-compression press; and removing the bridge.
申请公布号 KR20130134922(A) 申请公布日期 2013.12.10
申请号 KR20120058821 申请日期 2012.05.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HWANG, YONG WOOK;CHO, SUNG HO;MOON, HEE CHEUL;BAEK, SEUNG CHANG;PARK, CHAN SEOB
分类号 H04B1/38;H01M2/10 主分类号 H04B1/38
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