A LED PACKAGE OR A LED ARRAY HAVING A DIELECTRIC LAYER WITH IMPROVED HEAT TRANSFER CAPABILITY

摘要

The light-emitting diodes (LED) arrays of the present invention comprise an LED chip, a molding member sealing the LED chip, a heating slug or thermal via in contact with the molding member, a dielectric layer and a base layer consisting a metal-core printed circuit boards (MCPCB) substrate, a solder part of which the LED chip is attached to the MCPCB substrate and is electrically connected to the substrate, and the dielectric layer is composed of a thermosetting or photocurable resin and carbon nano tubes