发明名称 Low rise camera module
摘要 A printed circuit carrier has an opening therein against which a back plate is attached to thereby form a cavity. An image sensor device is attached to the back plate inside the cavity. The height of the image sensor device is about equal to or less than the height of the cavity. Electrical signal connections are formed between the image sensor device and the printed circuit carrier. A cap is attached directly to the carrier by a flowable adhesive layer, to seal off the cavity. Other embodiments are also described and claimed.
申请公布号 US8605211(B2) 申请公布日期 2013.12.10
申请号 US201113096659 申请日期 2011.04.28
申请人 WEBSTER STEVEN;TEMPLETON THOMAS B.;APPLE INC. 发明人 WEBSTER STEVEN;TEMPLETON THOMAS B.
分类号 H04N5/225 主分类号 H04N5/225
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