| 摘要 |
A method for manufacturing a printed circuit film attachment type LED lighting by using a hybrid heat radiation base and injection molding according to the present invention comprises steps of: eliminating a release sheet from raw printed circuit film; coating an adhesive on the printed circuit film where the release sheet is eliminated by heating and pressing; printing an electrical circuit pattern on the surface of the printed circuit film where the adhesive is coated by using a paste including a conductive material; immersing the printed circuit film, where the conductive paste is printed, into an electrolytic copper solution and performing a plating process via electrolysis; printing a PSR paste on the surface of a copper-plated printed circuit film; printing a cream solder at a soldering part of the surface of the printed circuit film; mounting automatically an LED chip on a cream solder printed part; heating the cream solder and soldering the LED chip; attaching the adhesive on the heat radiation plate; cutting the raw printed circuit film into unit printed circuit film; forming a lighting lamp body equipped with screw threads able to be coupled to a socket by insert-injecting an insulation material and an aluminum plate; attaching temporarily the unit printed circuit film at an upper part of the plate by heating the adhesive on the plate; maximizing an adhesive force and eliminating bubbles by using pneumatic pressure and heat; and connecting a power line to a connector connected to the electrical circuit pattern via a hole at a center of a lighting lamp body. [Reference numerals] (AA) Start;(BB) End;(S21) Eliminate a release sheet from raw printed circuit film;(S22) Coat an adhesive on the printed circuit film where the release sheet is eliminated;(S23) Print an electrical circuit pattern on the surface of the printed circuit film where the adhesive is coated;(S24) Immerse the printed circuit film, where the conductive paste is printed, into an electrolytic copper solution and perform a plating process via electrolysis;(S25) Print a PSR paste on the surface of a copper-plated printed circuit film;(S26) Print a cream solder at a soldering part of the surface of the printed circuit film;(S27) Mount automatically an LED chip on a cream solder printed part;(S28) Heat the cream solder and soldering the LED chip;(S29) Attaching the adhesive on the heat radiation plate;(S30) Cut the raw printed circuit film into unit printed circuit film;(S31) Form a lighting lamp body equipped with screw threads able to be coupled to a socket by insert-injecting an insulation material and an aluminum plate;(S32) Attach temporarily the unit printed circuit film at an upper part of the plate by heating the adhesive on the plate;(S33) Maximize an adhesive force and eliminating bubbles by using pneumatic pressure and heat;(S34) Connect a power line to a connector connected to the electrical circuit pattern |
