| 发明名称 |
CAPACITOR FOR INTERPOSERS AND METHODS OF MANUFACTURE THEREOF |
| 摘要 |
Disclosed is a method for designing and manufacturing a capacitor for those substrates such as an interposer. A through via is formed on an interposer and a capacitor is formed between a low level metalizing layer and a high level metalizing layer. The capacitor can be a flat-type capacitor with dual capacitor dielectric layers. |
| 申请公布号 |
KR20130135005(A) |
申请公布日期 |
2013.12.10 |
| 申请号 |
KR20120109905 |
申请日期 |
2012.10.04 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHANG CHUN HUA;YEH DER CHYANG;CHENG KUANG WEI;LIU YUAN HUNG;HOU SHANG YUN;CHIOU WEN CHIH;JENG SHIN PUU |
| 分类号 |
H01L21/8242;H01L27/108 |
主分类号 |
H01L21/8242 |
| 代理机构 |
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