| 摘要 |
The present invention relates to a semiconductor integrated circuit with a stack package structure and a driving method thereof, and for the semiconductor integrated circuit on which at least one semiconductor chip is stacked, the semiconductor chip includes a selection control circuit for selecting a chip unit assignment signal assigned to itself among multiple chip unit assignment signals inputted through multiple pads; and an internal circuit for performing a preset activity in response to the chip unit assignment signal selected by the selection control circuit. [Reference numerals] (212A) Control circuit |
