| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device, a breakage estimation method and a life estimation method, capable of improving reliability of solder joint.SOLUTION: An electronic device includes: a heat dissipation board; a first joint portion provided on the heat dissipation board; a second joint portion provided on the heat dissipation board so as to be spaced from the first joint portion; an insulating board having a region including corners in contact with the first joint portion; a first sensor provided closer to the first joint portion than the second joint portion on the insulating board, for measuring acceleration of vibration to be applied to the insulating board; a first calculation unit using the acceleration measured by the first sensor to calculate a response spectrum of the acceleration; a determination unit comparing a frequency of a maximum peak of the response spectrum calculated by the first calculation unit with a reference frequency to determine a progress state of a joint defect of the first joint portion; and an estimation unit estimating breakage of the second joint portion on the basis of the progress state determined by the determination unit. |
