发明名称 CONTINUOUS PLATING EQUIPMENT AND CONTINUOUS PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method for obtaining a metalized resin film, which causes no wrinkle and no distortion even when the film is wound into a roll state after producing the metalized resin film by a continuous plating method.SOLUTION: A continuous plating equipment includes plating cells 11a-11d, electricity supply rolls 16a-16e, an inversion roll 13, and anodes 14a-14h, and further includes an electric plating mechanism for performing electric plating continuously while conveying a long conductive substrate F, a winding roll 19 for winding a conductive substrate S after plating, tension cutting rolls 15a, 15b which reduces a conveying tension of the conductive substrate S between the electric plating mechanism and the winding roll 19 to a level smaller than a minimum necessary conveying tension for the conductive substrate F in the electric plating mechanism, and a driving roll 17 for adjusting the conveying tension of the conductive substrate S conveyed from the tension cutting rolls 15a, 15b. The tension cutting rolls 15a, 15b are arranged such that a holding angle of the conductive substrate S becomes within the range of 90°-270°.
申请公布号 JP2013245390(A) 申请公布日期 2013.12.09
申请号 JP20120121367 申请日期 2012.05.28
申请人 SUMITOMO METAL MINING CO LTD 发明人 USUI DAISUKE
分类号 C25D7/06;C25D17/00;C25D21/00;C25D21/12 主分类号 C25D7/06
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