| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a defect inspection device.SOLUTION: With respect to a TFT substrate 2 in a mother board that is placed on a defect inspection device 100, voltage is applied by a voltage application part provided at a probe frame 3. If the voltage is applied to the TFT substrate 2 normally, a protection circuit provided at an outer peripheral region of an active area (effective display region) of the TFT substrate 2 generates heat. By confirming the heat generation of the protection circuit from an infrared image acquired by imaging the TFT substrate 2 with a first infrared camera 4 and a second infrared camera 5, it can be confirmed that the voltage is applied correctly to the TFT substrate. In this state, as the voltage is correctly applied to the active area as well, the heat generation point can be specified as a defective point caused by short circuit of wiring and the like from the infrared image which imaged the active area. |
