| 摘要 |
PURPOSE: A chip-inlaid flooring material using PLA(polylactic acid) resin is provided to improve strength and processability. CONSTITUTION: A chi-inlaid flooring material(100) using PLA resin contains a chip-inlaid layer(110), a middle layer(120), and a basal layer(130). One or more layers among the layers contain PLA resin as a binder. The chip-inlaid layer further contains one or more materials among non-phthalate-based plasticizer, an acryl-based copolymer, and an anti-hydrolyzing agent. [Reference numerals] (110) Chip-inlaid layer; (120) Middle layer; (130) Basal layer |
