| 摘要 |
<p>The present invention relates to a hardware stability verification method of an electronic module in which a semiconductor component is mounted and, more specifically, to the hardware stability verification method of the electronic module in which the semiconductor component is mounted and used for operating a vehicle. The hardware stability verification method of the electronic module, in which the semiconductor component is mounted, comprising: a step of converting the electric characteristic of the semiconductor component by applying current, voltage, or static electricity to the selected semiconductor component; a step of mounting the converted semiconductor component in the hardware of the electronic module; a step of confirming the operation condition of the hardware in the electronic module in which the semiconductor component is mounted; a step of applying temperature, vibration, or EMI to the set hardware of the electronic module; and a step of determining the condition of the hardware in the electronic module in which the external stress is applied. [Reference numerals] (AA) Start;(BB) End;(S200) Selecting a core semiconductor component which is influence on an electronic module;(S202) Applying overload to semiconductor components;(S204) Mounting a semiconductor component including external stress in the hardware of an electronic module;(S206) Detecting faults after applying a fault environment to the hardware of an electronic module</p> |
