| 摘要 |
PROBLEM TO BE SOLVED: To resolve a problem that, at a connection part between a first bump penetrating through a semiconductor substrate to be a part of a through electrode penetrating through a semiconductor chip, and an intermediate wire to be a part of the through electrode, the first bump is contracted by thermal stress, and a gap is generated at a bonding surface with the intermediate wire, which may cause increase in electric resistance.SOLUTION: In a semiconductor device, for the purpose of suppressing contraction by thermal stress, a projection part is provided to an intermediate wire side so that a connection end part with an intermediate wire 26 of a first bump (17) is uneven. The projection part may be a projection part 14b made of an insulation material, or a projection part made of a conductive material. |
