发明名称 LASER DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a laser device capable of stably obtaining a component in cutting a mild steel thick plate by a laser beam and excellent in yield and productivity.SOLUTION: A laser device includes: a workpiece temperature detecting means for detecting a temperature of a workpiece; a workpiece temperature distribution calculating means for calculating a temperature of respective portions of the workpiece other than the portions detected by the temperature detecting means with the usage of a thickness, thermal conductivity and heat capacity of the workpiece inputted in advance; an axis movement means for moving a machining torch to an optional position; and a laser beam machining parameter control means for controlling laser output and an assist gas flow rate. In correspondence with the temperature of the workpiece, the machining torch is moved, or the laser output and the assist gas flow rate are controlled.
申请公布号 JP2013244505(A) 申请公布日期 2013.12.09
申请号 JP20120119654 申请日期 2012.05.25
申请人 PANASONIC CORP 发明人 HAYASHIKAWA HIROYUKI;KOYAMA MASAKI;EGUCHI SATOSHI
分类号 B23K26/38;B23K26/00;B23K26/08;B23K26/14 主分类号 B23K26/38
代理机构 代理人
主权项
地址