| 摘要 |
PROBLEM TO BE SOLVED: To provide a support structure such as an IC substrate and an IC interposer that has a high density of many conductive layers and vias and exhibits reliability, appropriate electrical performance, thinness, stiffness, planarity, good heat dissipation, and a competitive unit price.SOLUTION: A multilayer composite electronic structure 100 comprises at least two feature layers extending in an X-Y plane and separated by a via layer comprising a dielectric material that is sandwiched between two adjacent feature layers 102, 104, 106. The via 118 layer comprises via posts that couple adjacent feature layers in a Z direction perpendicular to the X-Y plane. A first via has different dimensions in the X-Y plane than a second via in the via layer. |
