| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive resin composition and a conduction resin film, capable of exhibiting high flexibility and high strength and excellent film forming processability even when the ratio of conductive filler is high.SOLUTION: A conductive resin composition contains: a thermoplastic resin having limiting viscosity [&eegr;] of 0.9-1.5; an olefin-based polymer having carboxyl group, acid anhydride group, epoxy group, (meth)acryloyl group, amino group, alkoxysilyl group, hydroxy group, isocyanate group or oxazoline group; a hydrogenated diene-based polymer having carboxyl group, acid anhydride group, epoxy group, (meth)acryloyl group, amino group, alkoxysilyl group, hydroxy group, isocyanate group or oxazoline group; and the conductive filler, wherein the ratio of the conductive filler is 10-60 pts.mass per 100 pts.mass total of the thermoplastic polyester resin, the olefin-based polymer and the hydrogen addition diene-based polymer. |
