发明名称 HEAT DISSIPATION SYSTEM FOR POWER MODULE
摘要 PROBLEM TO BE SOLVED: To provide a heat dissipation system for a power module capable of efficiently dissipating heat generated from a power module.SOLUTION: Disclosed herein is a heat dissipation system for a power module, including: a manifold 110 including an inlet and an outlet and formed to be opened at a surface thereof in contact with a nozzle member 120; a nozzle member 120 formed at an upper portion of the manifold 110 and including inclined nozzles through which a cooling medium introduced through the inlet of the manifold 110 passes; and a nozzle chamber 130 formed on the nozzle member 120 and forming a separation space separated from the nozzle member 120.
申请公布号 JP2013247354(A) 申请公布日期 2013.12.09
申请号 JP20120197464 申请日期 2012.09.07
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KWAK YOUNG HOON;OH KYU HWAN
分类号 H01L23/473;H05K7/20 主分类号 H01L23/473
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