发明名称 |
HEAT DISSIPATION SYSTEM FOR POWER MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation system for a power module capable of efficiently dissipating heat generated from a power module.SOLUTION: Disclosed herein is a heat dissipation system for a power module, including: a manifold 110 including an inlet and an outlet and formed to be opened at a surface thereof in contact with a nozzle member 120; a nozzle member 120 formed at an upper portion of the manifold 110 and including inclined nozzles through which a cooling medium introduced through the inlet of the manifold 110 passes; and a nozzle chamber 130 formed on the nozzle member 120 and forming a separation space separated from the nozzle member 120. |
申请公布号 |
JP2013247354(A) |
申请公布日期 |
2013.12.09 |
申请号 |
JP20120197464 |
申请日期 |
2012.09.07 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KWAK YOUNG HOON;OH KYU HWAN |
分类号 |
H01L23/473;H05K7/20 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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