摘要 |
PROBLEM TO BE SOLVED: To simplify a step for winding a thin plate material around conductor wires, when a metallic thin plate material is used as a member for bundling a plurality of the conductor wires.SOLUTION: A thin plate material 12 and a plurality of conductor wires 14 are disposed in a groove-shaped holding portion 16 of a holding mold 10. The thin plate material 12 has an extending portion 24 extending from the holding portion 16 to the outside. A folding mold 28 is recessed on a lower surface, and has a bending portion 30 for bending the extending portion 24. When the folding mold 28 is moved in a longitudinal direction L, a bending surface 34 of the bending portion 30 pushes and bends the extending portion 24 inward to cover an upper surface of the conductor wires 14. The thin plate material 12 is folded and wound around the conductor wires 14, thereby manufacturing an aggregate conductor 42. |