| 摘要 |
PROBLEM TO BE SOLVED: To provide an aggregate substrate increasing a number of obtaining good wiring substrates, and having high manufacturing efficiency.SOLUTION: An aggregate substrate 10 is made by integrally forming a plurality of square-shaped product areas A having wiring conductors made from a conductive layers 2 and arranged in a matrix shape, and cutting areas C extending in a band-shape between the product areas A, in a wiring substrate panel made by alternately laminating a plurality of sheet-shaped insulation resin layers 1 and a plurality of the pattern-formed conductive layers 2. In the cutting areas C between the product areas 1, reinforcing patterns 7 made from the conducive layers 2 formed in a layout which has no clearance when viewed from a direction along the extending direction of the cutting area C are formed. |
