发明名称 MULTILAYER STRUCTURE CIRCUIT BOARD, AND GAME MACHINE
摘要 PROBLEM TO BE SOLVED: To provide a multilayer structure circuit board capable of preventing a player from visually recognizing a circuit pattern formed on a base board, and preventing increase of fraud.SOLUTION: A first base board 208 and a second base board 210 are non-conductive layers. Conductive layers 208A and 210A are vapor-deposited to the surface thereof. Conductive layers 208B and 210B are also vapor-deposited to back surfaces. A circuit pattern, a ground layer or a power supply layer is formed on the conductive layers 208A, 208B, 210A and 210B. In both the first base board 208 and the second base board 210, the circuit pattern is formed on the conductive layers 208B and 210A on one surface, the power supply layer or the ground layer is formed on the conductive layers 208B and 210B on the other surface, and the power supply layer or the ground layer is arranged on the conductive layers serving as the top and bottom surfaces of the stacked layers.
申请公布号 JP2013244175(A) 申请公布日期 2013.12.09
申请号 JP20120119681 申请日期 2012.05.25
申请人 HEIWA CORP 发明人 SATO TOMONARI
分类号 A63F7/02 主分类号 A63F7/02
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