发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor element capable of improving driving ability of the semiconductor element and suppressing deterioration in element characteristics.SOLUTION: There is provided a method of manufacturing a semiconductor element comprising: a step S1 of forming a layer on a surface of a substrate, the layer having a melting point higher than the substrate; a step S2 of heating the layer by irradiating the layer with laser and melting a part of the surface of the substrate, thereby making the part of the surface of the substrate in a wave pattern; a step S3 of removing the layer and exposing the part of the surface of the substrate; and a step S4 of forming a semiconductor element including the exposed part of the surface of the substrate.
申请公布号 JP2013247272(A) 申请公布日期 2013.12.09
申请号 JP20120120622 申请日期 2012.05.28
申请人 SEIKO EPSON CORP 发明人 SHIMADA HIROYUKI
分类号 H01L21/20;B23K26/00;H01L21/268 主分类号 H01L21/20
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