发明名称 SEALING RESIN MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a sealing resin molding device capable of scraping out resin burrs having entered an opening between a frame member and a bottom surface member.SOLUTION: A sealing resin molding device is composed of: an upper die having an electronic component mounting substrate held on the lower surface; and a lower die which is arranged opposite to the upper die and includes a frame member which is placed on a pressure member vertically driven by a first drive mechanism via an elastic member, and a bottom surface member which is driven inside the frame member so as to be vertically slidable.
申请公布号 JP2013247315(A) 申请公布日期 2013.12.09
申请号 JP20120121587 申请日期 2012.05.29
申请人 TOWA CORP 发明人 TAKASE SHINJI;KO TAKEAKI;TAMURA KOJI
分类号 H01L21/56;B29C43/18;B29C43/32;B29L31/34 主分类号 H01L21/56
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