发明名称 |
SEALING RESIN MOLDING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a sealing resin molding device capable of scraping out resin burrs having entered an opening between a frame member and a bottom surface member.SOLUTION: A sealing resin molding device is composed of: an upper die having an electronic component mounting substrate held on the lower surface; and a lower die which is arranged opposite to the upper die and includes a frame member which is placed on a pressure member vertically driven by a first drive mechanism via an elastic member, and a bottom surface member which is driven inside the frame member so as to be vertically slidable. |
申请公布号 |
JP2013247315(A) |
申请公布日期 |
2013.12.09 |
申请号 |
JP20120121587 |
申请日期 |
2012.05.29 |
申请人 |
TOWA CORP |
发明人 |
TAKASE SHINJI;KO TAKEAKI;TAMURA KOJI |
分类号 |
H01L21/56;B29C43/18;B29C43/32;B29L31/34 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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