| 发明名称 |
APPARATUS FOR SUPPLYING LEAD FRAME |
| 摘要 |
According to the present invention, an apparatus for supplying a lead frame prevents the position change of the lead frame when an adhesive is spread on the lead frame in a process space, a semiconductor is mounted, or a molding resin is spread. |
| 申请公布号 |
KR20130133506(A) |
申请公布日期 |
2013.12.09 |
| 申请号 |
KR20120056813 |
申请日期 |
2012.05.29 |
| 申请人 |
TOP ENGINEERING CO., LTD. |
发明人 |
KIM, YUN GI;ROH, SEUNG JIN |
| 分类号 |
H01L21/50;H01L23/495 |
主分类号 |
H01L21/50 |
| 代理机构 |
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| 主权项 |
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