发明名称 POWER SUPPLY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a power supply device capable of radiating heat generated at a stacked part more efficiently, in a power supply device configured by laminating a plurality of flat-type power supply packs each housing in a laminate pack an electrode group obtained by laminating positive electrode plates and negative electrode plates.SOLUTION: A power supply device BS (BS1, BS2) is configured by stacking a plurality of flat-type power supply packs LP (LP1 to LP5) each housing in a laminate pack an electrode group 1 obtained by laminating positive electrode plates 2 and negative electrode plates 3. The power supply device BS (BS1, BS2) has such a configuration that thermal conduction members 21 (21A, 21B) interposed between the laminated flat-type power supply packs LP and on upper and lower surfaces is provided, and the thermal conduction members 21 are thermally coupled at its side part region, and the coupled side part region is contacted with a heat radiation part provided at a side part of an outer container 10.
申请公布号 JP2013247024(A) 申请公布日期 2013.12.09
申请号 JP20120120997 申请日期 2012.05.28
申请人 SHARP CORP 发明人 KOMODA MUTSUKO;TORATA NAOTO;NISHIMURA NAOTO
分类号 H01M2/10;H01G2/08;H01G11/00;H01M2/02;H01M10/50 主分类号 H01M2/10
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