| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film wiring board which inhibits mechanical destruction such as cracks in through conductors and thin film wiring conductors.SOLUTION: A thin film wiring board includes: a ceramic substrate 1 having an upper surface; multiple resin insulation layers 2 and multiple thin film wiring conductors 3 laminated on the upper surface of the ceramic substrate 1; and through conductors 4, each of which penetrates through the resin insulation layer 2 in a thickness direction and connects with the thin film wiring conductors 3 at end parts. Each thin film wiring conductor 3 has a recessed part 5 immediately below the through conductor 4. The thin film wiring conductor 3 is easily deformed in portion provided with the recessed part 5, and stress occurring between the insulation resin layer 2 and the thin film wiring conductor 3 is eased by the deformation. Thus, mechanical destruction such as peeling is inhibited between the thin film wiring conductors 3 and the resin insulation layer 2. |
