| 摘要 |
The present invention relates to a polyamide-imide film and a method for manufacturing the same and, more specifically, to a polyamide-imide film which is formed with polyamic acid, which is made by copolymerization of diamine, dianhydride, and aromatic dicarbonyl compounds, and which has the coefficient of thermal expansion (CTE) of less than 5 ppm/°C and a method for manufacturing the polyamide-imide film. |
