| 摘要 |
<p>Embodiments of the present disclosure include a curable composition including an epoxy compound selected from the group consisting of aromatic epoxy compounds, alicyclic epoxy compounds, aliphatic epoxy compounds, and combinations thereof, a curing agent selected from the group consisting of novolacs, amines, anhydrides, carboxylic acids, phenols, thiols, and combinations thereof, and a phosphono-methyl-glycine.</p> |
