| 摘要 |
PURPOSE: An element inspection apparatus is provided to improve reliability of an element inspection result by executing an inspection process at the wafer state, a pick and place process, and a follow-up inspection process through one device. CONSTITUTION: A wafer ring loading unit(100) loads a wafer ring in which elements are attached. An element inspection unit(200) receives the wafer ring from the wafer ring loading unit and executes a surface inspection for the elements attached to the wafer ring. An unloading unit(300) settles elements having fair quality which are inspected by a pickup tool(510) and the element inspection unit in a tray. An empty tray unit(400) settles elements having defects in the tray. A wafer ring transferring unit(700) draws out the wafer ring from the wafer ring loading unit and transfers the wafer ring to the element inspection unit. |
