发明名称 THERMAL TRANSFER MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a primary vacuum thermoform method connected to a thermal transfer process.SOLUTION: A thermal transfer molding method includes a step of conducting thermal transfer printing on a resin sheet to be used for vacuum thermoforming, a step of vacuum thermoforming the resin sheet to obtain a blister product, and a step of integrally forming a foamed body of a foaming plastic and the blister product. The blister product produced by the molding method has not only a more excellent production process but also more excellent scratch resistance and separation resistance.
申请公布号 JP2013244746(A) 申请公布日期 2013.12.09
申请号 JP20120245089 申请日期 2012.11.07
申请人 LEUNG KWUN WA 发明人 LEUNG KWUN WA
分类号 B29C69/00 主分类号 B29C69/00
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