NON-CONDUCTIVE POLYMER ADHESIVE MATERIAL FOR PACKAGING OF DEVICE AND FILM USING THE SAME

摘要

The present invention relates to an adhesive for electronic packaging using a flip chip mode. The adhesive includes a thermosetting resin, a thermoplastic resin, a latent curing agent, and a photoacid generating agent (TAG). The present invention relates to a non non-conductive polymer joint material for electronic packaging which removes the oxide layer of a metallic solder formed on the upper end of the electrode of an electric device during electronic packaging the photoacid generator (TAG) is included is the polymer adhesion material.