WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board and a wiring board manufacturing method capable of forming plural wirings.SOLUTION: The wiring board includes: a resin substrate 111 on which a first through hole and a second through hole are formed; a metal foil formed on one face of the resin substrate 111 and divided into a first side and a second side along a boundary of the first through hole and the second through hole; a first via 114A formed of a plating film connected to the metal foil on the first side in the first through hole; a second via 114B formed of a plating film connected to the metal foil on the second side in the second through hole; a first slit penetrating through the metal foil and the first via; a second slit penetrating through the metal foil and the second via; a first plating layer 115A formed on a surface of the metal foil on the first side, a bottom face of the first via, and a side face in the first via and the first slit of the metal foil on the first side; and a second plating layer 115B formed on a surface of the metal foil on the second side, a bottom face of the second via, and a side face in the second via and the second slit of the metal foil on the second side.